CCL/PPG Copper Clad Laminate/Pre Preg
Copper Clad Laminate/Pre Preg
Copper Clad Laminate/Pre Preg
Key material for IC package substrate for semiconductors

PPG is manufactured by impregnating glass fibers with resin and then hardening them, and plays the role of a bonding sheet in the stacking process of package substrate(connects semiconductors to PCB). CCL, a laminated Cu foil layer formed by coating both sides of PPG with copper, plays the role of an insulator. CCL and PPG are key materials of a semiconductor's IC package substrate. With their excellent electrical characteristics and reliability, they make possible miniaturization and thin-layer manufacturing of semiconductor devices.

Product inquiry
Applications
PC/server DRAM PC/server DRAM
mobile DRAM mobile DRAM
NAND NAND
graphic DRAM graphic DRAM
SiP/communication semiconductor(5G) SiP/communication semiconductor(5G)
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Product functions and structure
· Excellent flip chip solutions with fine thickness control and non-wet free characteristic
· War page control solution with low stress and low shrinking rate
· Can produce thin-layered board with high strength
· Can produce high-speed/low-loss substrate with low Dk&Df
Product Classification
Product Classification :Category ,Grade ,Features ,Applications ,Download
Grade Features Applications Download
PC/server DRAM
• BOC: general-purpose product
• Flip chip: excellent flip chip joining solution with low Dk(non-wet free)
PC/server DRAM
Graphic DRAM
• Can handle high-speed processing with low Dk has excellent flip chip joining solution with low Dk(non-wet free)
Graphic DRAM
Mobile DRAM
• Has product line-up that is responsive to various CTE and stresses
•Can produce thin and high-strength substrate
• Can provide low and optimal warpage control with a wide range of responses to Tg
•Has excellent anti-crack feature and high reliability from T/C(Thermo Cycle) test
Mobile DRAM
NAND
•Has product line up responsive to various CTE characteristics
•Can produce thin and high-strength substrate
•Has excellent anti-crack feature and high reliability from T/C(Thermo Cycle) test
NAND
SiP/5G
• Can produce high-speed/low-loss substrate with low Dk&Df
• Has wide process margin and excellent processability
SiP/communication semiconductor(5G)