DAF Die Attach Film
Die Attach Film
Die Attach Film
Ultra-thin film adhesive material for lamination and slimization of semiconductor packages

DAF(Die Attach Film) is an ultra-thin film adhesive used to connect semiconductor chips to circuit boards or chips to chips in the semiconductor packaging process. It is an essential material used in manufacturing flash memories, etc. in the post-manufacturing process of semiconductors. Lamination and manufacturing of thin layers of semiconductors are possible with its excellent reliability and easy processability.

Product inquiry
Applications
PC/server PC/server
graphic DRAM graphic DRAM
mobile DRAM mobile DRAM
NAND NAND
AP AP
fingerprint sensor fingerprint sensor
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Product Functions and Structure
· Has excellent pick-up characteristic and processability
· Has void free and anti-heat characteristics and excellent reliability
· Has excellent burial ability through viscosity and cure control
DAF Process
DAF 제조 공정 : Wafer Backside Lamination(WBL), Dicing(Sawing), UV/Expanding, Die Bonding, Chip th substrate
DAF 제조 공정 : Wafer Backside Lamination(WBL), Dicing(Sawing), UV/Expanding, Die Bonding, Chip th substrate
Product Classification
Product Classification :Category ,Grade ,Features ,Applications ,Download
Grade Features Applications Download
Normal
* Thickness (μm) : 5/ 10 / 20 * Mold Void Free * Can support various dicing processes such as Blade/GAL/DBG
Chip-to-chip or chip-to-board adhesive film
FOW(Film over Wire)
*Thickness (μm) : 50 ~ 80 * Pre-cure Void Free *Has excellent fillet and wire burying ability * Has excellent HAST reliability
Wire-burial type adhesive film
FOD(Film over Die)
* Thickness (μm) : 90~120 * Pre-cure Void Free * Has excellent controller chip and great void characteristic around wire * Has excellent HAST reliability * Can support various dicing processes such as Blade/GAL/DBG * GAL process is possible
Controller chip burial type adhesive film